Gender: : Male
Branch: : Electronics Engineering
City : Adilabad
ic technology Notes
1. 0
Environment and Crystal Growth for VLSI Technology
8
1.1
Environment: Semiconductor technology trend, Clean rooms, Wafer cleaning
1.2
Semiconductor Substrate: Phase diagram and solid solubility, Crystal structure, Crystal defects, Czochralski growth, Bridgman growth of GaAs, Float Zone growth, Wafer Preparation and specifications
2.0
Fabrication Processes Part 1
10
2.1
Deposition: Evaporation, Sputtering and Chemical Vapor Deposition
2.2
Epitaxy: Molecular Beam Epitaxy, Vapor Phase Epitaxy, Liquid Phase Epitaxy, Evaluation of epitaxial layers
2.3
Silicon Oxidation: Thermal oxidation process, Kinetics of growth, Properties of Silicon Dioxide, Oxide Quality, high κ and low κ dielectrics
2.4
Diffusion: Nature of diffusion, Diffusion in a concentration gradient, diffusion equation, impurity behavior, diffusion systems, problems in diffusion, evaluation of diffused layers
2.5
Ion Implantation: Penetration range, ion implantation systems, process considerations, implantation damage and annealing
3.0
Fabrication Processess Part 2
10
3.1
Etching: Wet chemical etching, dry physical etching, dry chemical etching, reactive ion etching, ion beam techniques
3.2
Lithography: Photoreactive materials, Pattern generation and mask making, pattern transfer, Electron beam, Ion beam and X-ray lithography
3.3
Device Isolation, Contacts and Metallization: Junction and oxide isolation, LOCOS, trench isolation, Schottky contacts, Ohmic contacts, Metallization and Packaging
3.4
CMOS Process Flow: N well, P-well and Twin tub
3.5
Design rules, Layout of MOS based circuits (gates and combinational logic), Buried and Butting Contact
4.0
Measurements, Packaging and Testing
10
4.1
Semiconductor Measurements: Conductivity type, Resistivity, Hall Effect Measurements, Drift Mobility, Minority Carrier Lifetime and diffusion length
4.2
Packaging: Integrated circuit packages, Electronics package reliability
4.3
Testing: Technology trends affecting testing, VLSI testing process and test equipment, test economics and product quality
5.0
SOI, GaAs and Bipolar Technologies
08
5.1
SOI Technology: SOI fabrication using SIMOX, Bonded SOI and Smart Cut, PD SOI and FD SOI Device structure and their features
5.2
GaAs Technologies: MESFET Technology, Digital Technologies, MMIC technologies, MODFET and Optoelectronic Devices
5.3
Silicon Bipolar Technologies: Second order effects in bipolar transistor, Performance of BJT, Bipolar processes and BiCMOS
6.0
Novel Devices
06
6.1
Multigate Device: Various multigate device configurations (device structure and important features)
6.2
Nanowire: Fabrication and applications
6.3
Graphene Device: Carbon nanotube transistor fabrication, CNT applications
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